Semiconductor device and method for producing a semiconductor de

Details Semiconductor device and method for producing a semiconductor de Semiconductor device and method for producing a semiconductor de

1997-04-18

1998-09-08

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438122, H01L 2144

Patent

active

058044698

ABSTRACT:
A method for producing a semiconductor device includes: a) an attaching process in which a flat-plate member is positioned on a flat-shape lead frame provided with a plurality of leads and a plurality of support bars so that the flat-plate member contacts at least the plurality of leads, and the flat-plate member is attached to plurality of support bars; b) an element mounting process in which a semiconductor element is mounted on the flat-plate member attached to the plurality of support bars of the flat-shape lead frame; c) a wire-bonding process in which a wire is provided between each of the plurality of leads and the semiconductor element; and d) a separating process, performed after the completion of the wire-bonding process, in which the plurality of support bars are deformed so as to separate the flat-plate member and the plurality of leads and electrically disconnect or separate the flat-plate member from the plurality of leads.

REFERENCES:
patent: 3978578 (1976-09-01), Murphy
patent: 5177032 (1993-01-01), Fogal et al.
patent: 5327008 (1994-07-01), Djennas et al.
patent: 5378656 (1995-01-01), Kajihara et al.
patent: 5384286 (1995-01-01), Hirai
patent: 5394607 (1995-03-01), Chiu et al.
patent: 5527743 (1996-06-01), Variot
patent: 5541447 (1996-07-01), Maejima et al.

Affiliated with

Also associated with

Rating

Semiconductor device and method for producing a semiconductor de does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method for producing a semiconductor de, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for producing a semiconductor de will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1281487