Semiconductor device and method for manufacturing the same

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Mesa formation

Reexamination Certificate

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Details

C438S164000, C438S459000, C257SE33065, C257SE29117, C257SE21415

Reexamination Certificate

active

07964423

ABSTRACT:
The invention relates to a semiconductor device and a method for manufacturing the semiconductor device, which includes: an insulating film over a substrate; a first pixel electrode embedded in the insulating film; an island-shaped single-crystal semiconductor layer over the insulating film; a gate insulating film and a gate electrode; an interlayer insulating film which covers the island-shaped single-crystal semiconductor layer and the gate electrode; a wiring which electrically connects a high-concentration impurity region and the first pixel electrode to each other; a partition which covers the interlayer insulating film, the island-shaped single-crystal semiconductor layer, and the gate electrode and has an opening in a region over the first pixel electrode; a light-emitting layer formed in a region which is over the pixel electrode and surrounded by the partition; and a second pixel electrode electrically connected to the light-emitting layer. A surface of the first pixel electrode, which is in contact with the light-emitting layer, is flat, and a surface where the insulating film is in contact with the island-shaped single-crystal semiconductor layer roughly coincides with a surface where the first pixel electrode is in contact with the light-emitting layer.

REFERENCES:
patent: 6905907 (2005-06-01), Konuma
patent: 6953735 (2005-10-01), Yamazaki et al.
patent: 7145536 (2006-12-01), Yamazaki et al.
patent: 7411215 (2008-08-01), Hayakawa et al.
patent: 7695996 (2010-04-01), Dupont et al.
patent: 2005/0266591 (2005-12-01), Hideo
patent: 2009/0001469 (2009-01-01), Yoshida et al.
patent: 2009/0051046 (2009-02-01), Yamazaki et al.
patent: 2009/0081850 (2009-03-01), Ohnuma et al.
patent: 2010/0081253 (2010-04-01), Kurata et al.
patent: 11-163363 (1999-06-01), None
patent: 11-163363 (1999-06-01), None
patent: 2007-35964 (2007-02-01), None

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