Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – With current flow along specified crystal axis
Reexamination Certificate
2011-06-21
2011-06-21
Vu, Hung (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
With current flow along specified crystal axis
C257S627000, C257S628000
Reexamination Certificate
active
07964899
ABSTRACT:
An active region and an isolation region are formed in the surface of a silicon semiconductor substrate having a (100) crystal plane as a principal surface. A gate insulating film and a gate electrode are formed on the active region in this order. A stress control film is formed to cover part of the active region where the gate electrode is not formed, the isolation region, the top surface of the gate electrode and sidewalls. A pair of stress control regions are formed to sandwich the gate electrode in the gate width direction of the gate electrode. In the stress control regions, the stress control film is not formed, or alternatively, a stress control film thinner than the stress control film formed on the gate electrode is formed.
REFERENCES:
patent: 7405436 (2008-07-01), Chidambarrao et al.
patent: 2004/0217448 (2004-11-01), Kumagai et al.
patent: 2005/0285150 (2005-12-01), Birner et al.
patent: 2004-87640 (2004-03-01), None
Jaeger, et al., “CMOS Stress Sensors on (100) Silicon,” IEEE Journal of Solid-State Circuits, Jan. 2000, pp. 85-95, vol. 35, No. 1, IEEE.
McDermott Will & Emery LLP
Panasonic Corporation
Vu Hung
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