Patent
1982-11-29
1986-08-05
James, Andrew J.
357 71, H01L 2348, H01L 2354
Patent
active
046046410
ABSTRACT:
The invention provides a semiconductor device having a semiconductor substrate with an active region including a buried contact and a field region including a field insulation layer. The device also includes a first polysilicon layer formed in the active region and on the field insulation layer, and a second polysilicon layer a portion of which is formed on said first polysilicon layer and another portion of which is formed on an isolation film covering a portion of the first polysilicon layer. The portion of the second polysilicon layer which is located above the field insulation layer is doped with metal or has a surface covered with a metal film. The semiconductor devices of the present invention operate at a high speed and are made small due to the use of multi-layer wiring.
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Clark S. V.
James Andrew J.
Tokyo Shibaura Denki Kabushiki Kaisha
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