Semiconductor device and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – Mesa structure

Reexamination Certificate

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Details

C257S327000, C257S347000, C257S401000, C257S618000, C257SE21704

Reexamination Certificate

active

08035199

ABSTRACT:
A semiconductor device has a semiconductor substrate, a semiconductor fin which is formed on the semiconductor substrate, which has a long side direction and a short side direction, and which has a carbon-containing silicon film including an impurity and a silicon film formed on the carbon-containing silicon film, a gate electrode which is formed to face both side surfaces of the semiconductor fin in the short side direction, source and drain regions which are respectively formed in the semiconductor fin located in the direction of both sides in the long side direction of the semiconductor fin so as to sandwich the gate electrode, and an element isolation insulating film which is formed on the side surface of the semiconductor fin and between the gate electrode and the semiconductor substrate.

REFERENCES:
patent: 5315143 (1994-05-01), Tsuji
patent: 7473964 (2009-01-01), Izumida
patent: 2005/0224800 (2005-10-01), Lindert et al.
patent: 2007/0221956 (2007-09-01), Inaba
patent: 2007-258485 (2007-10-01), None

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