Semiconductor device and method for manufacturing the same

Details Semiconductor device and method for manufacturing the same Semiconductor device and method for manufacturing the same

1990-06-21

1992-03-31

James, Andrew J.

357 68, H01L 2328, H01L 2348, H01L 2346

Patent

active

051012634

ABSTRACT:
In a plastic encapsulated semiconductor device, a part of wire piece may break down due to thermal fatigue, which positioned adjacent to a bonding portion of the wire piece connected to a chip. This is caused by that wire piece moves relative to plastic encapsulating the chip and the wire piece, and a strain in the wire piece due to thermal deformation of the device concentrates on one portion of the wire piece. Accordingly, a rugged portion is formed on a surface of a part of wire piece subjected to a breakdown to thermal fatigue. The plastic bites recesses of the rugged portion to prevent the wire piece from moving relative to the plastic, thereby preventing the wire piece from breaking down due to thermal fatigue.

REFERENCES:
T. H. Ramsey, "Metallurgical Behavior of Gold Wire in Thermal Compression Bonding", Solid State Tech., Oct. 1973, pp. 43-47.

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