Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-09-14
2010-02-16
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S462000
Reexamination Certificate
active
07662671
ABSTRACT:
A method of manufacturing a semiconductor device is disclosed, which includes at least the steps of preparing a laminated structure including a single chip or a plurality of chips, and dividing the laminated structure into a plurality of sub-laminated structures. A laminated structure comprised of a silicon substrate and a single chip or a plurality of chips laminated on the silicon substrate is formed. Then, the laminated structure is divided into a plurality of sub-laminated structures. Each of the sub-laminated structures includes a semiconductor device.
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Mulpuri Savitri
Oki Semiconductor Co., Ltd.
Rabin & Berdo P.C.
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