Semiconductor device and method for manufacturing the same

Details Semiconductor device and method for manufacturing the same Semiconductor device and method for manufacturing the same

2008-09-11

2010-02-02

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S784000, C257SE21506

Reexamination Certificate

active

07656034

ABSTRACT:
A semiconductor device includes a semiconductor element, a lead, and a gold wire electrically connecting an electrode of the semiconductor element and the lead. In the semiconductor device, the gold wire is covered with a metal and is a continuous film formed by plating.

REFERENCES:
patent: 5900738 (1999-05-01), Khandros et al.
patent: 7200930 (2007-04-01), Khandros et al.
patent: 7368328 (2008-05-01), Abbott et al.
patent: 2002/0113322 (2002-08-01), Terashima et al.
patent: 3240292 (2001-10-01), None
patent: 2002-76195 (2002-03-01), None

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