Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2009-06-18
2010-10-12
Dang, Phuc T (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S107000, C438S112000, C257S690000, C257S781000
Reexamination Certificate
active
07811856
ABSTRACT:
A method for manufacturing a semiconductor device, includes: mounting a semiconductor chip having an electrode on a wiring substrate having a base substrate and a wiring formed on the base substrate; forming a eutectic alloy by contacting the wiring with the electrode and by heating and pressurizing, and; forming the eutectic alloy so as a part of the eutectic alloy enters between the wiring and the base substrate.
REFERENCES:
patent: 7057294 (2006-06-01), Shibata
patent: 2006/0055021 (2006-03-01), Yamamoto
patent: 05-335309 (1993-12-01), None
patent: 2003-249592 (2003-09-01), None
patent: 2005-203598 (2005-07-01), None
patent: 2005203558 (2005-07-01), None
Dang Phuc T
Harness & Dickey & Pierce P.L.C.
Seiko Epson Corporation
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