Semiconductor device and method for manufacturing the same

Details Semiconductor device and method for manufacturing the same Semiconductor device and method for manufacturing the same

2008-04-22

2008-04-22

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having a perfecting coating

C438S462000, C257SE21599

Reexamination Certificate

active

11614748

ABSTRACT:
Embodiments relate to a semiconductor device and a method for manufacturing a semiconductor device that may be capable of improving a step coverage of main chip and scribe lane regions during a formation of an interlayer dielectric are provided. In embodiments, the semiconductor device may include metal layers formed on a substrate including a main chip region and a scribe lane region, respectively, an interlayer dielectric formed on the substrate including the metal layers, a step coverage improving layer formed on an interlayer dielectric of the scribe lane region, a via hole inside the step coverage improving layer and the interlayer dielectric, and a via plug formed by filling the via hole with a metal.

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patent: P1999-025046 (1999-04-01), None
patent: P1999-0081299 (1999-11-01), None

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