Semiconductor device and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Bipolar transistor structure – With base region having specified doping concentration...

Reexamination Certificate

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C257S586000, C438S350000, C438S318000, C438S320000

Reexamination Certificate

active

11117433

ABSTRACT:
By a non-selective epitaxial growth method, an SiGe film is grown on the whole surface of a silicon oxide film so as to cover an inner wall of a base opening. Here, such film forming conditions are selected that, inside the base opening, a bottom portion is formed of single crystal, other portions such as a sidewall portion are formed of polycrystalline, and a film thickness of the sidewall portion is less than or equal to 1.5 times the film thickness of the bottom portion. In this non-selective epitaxial growth, monosilane, hydrogen, diborane, and germane are used as source gases. Then, flow rates of monosilane and hydrogen are set to 20 sccm and 20 slm respectively. Also, a growth temperature is set to 650° C., a flow rate of diborane is set to 75 sccm, and a flow rate of germane is set to 35 sccm.

REFERENCES:
patent: 6177717 (2001-01-01), Chantre et al.
patent: 6482710 (2002-11-01), Oda et al.
patent: 6551891 (2003-04-01), Chantre et al.
Patent Abstracts of Japan, Publication No. 5-062991, dated Mar. 12, 1993.
Patent Abstracts of Japan, Publication No. 10-125691, dated May 15, 1998.
Patent Abstracts of Japan, Publication No. 11-126781, dated May 11, 1999.

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