Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-12-04
2007-12-04
Picardat, Kevin M. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S118000
Reexamination Certificate
active
10735767
ABSTRACT:
It is an object of the present invention to provide a technique for making a semiconductor device thinner without using a back-grinding method for a silicon wafer. According to the present invention, an integrated circuit film is mounted, thereby making a semiconductor device mounting the integrated circuit film thinner. The term “an integrated circuit film” means a film-like integrated circuit which is manufactured based on an integrated circuit manufactured by a semiconductor film formed over a substrate such as a glass substrate or a quartz substrate. In the present invention, the integrated circuit film is manufactured by a technique for transferring.
REFERENCES:
patent: 5206749 (1993-04-01), Zavracky et al.
patent: 5317236 (1994-05-01), Zavracky et al.
patent: 5376561 (1994-12-01), Vu et al.
patent: 5643804 (1997-07-01), Arai
patent: 5757456 (1998-05-01), Yamazaki
patent: 5804872 (1998-09-01), Miyano et al.
patent: 5821138 (1998-10-01), Yamazaki et al.
patent: 5834327 (1998-11-01), Yamazaki et al.
patent: 5861666 (1999-01-01), Bellaar
patent: 5877533 (1999-03-01), Arai
patent: 5976953 (1999-11-01), Zavracky
patent: 6027958 (2000-02-01), Vu et al.
patent: 6043800 (2000-03-01), Spitzer et al.
patent: 6118502 (2000-09-01), Yamazaki
patent: 6127199 (2000-10-01), Inoue et al.
patent: 6133626 (2000-10-01), Hawke et al.
patent: 6143582 (2000-11-01), Vu et al.
patent: 6208521 (2001-03-01), Nakatsuka
patent: 6242758 (2001-06-01), Yamazaki
patent: 6258623 (2001-07-01), Moden et al.
patent: 6265772 (2001-07-01), Yoshida
patent: 6312304 (2001-11-01), Duthaler et al.
patent: 6372608 (2002-04-01), Shimoda et al.
patent: 6376333 (2002-04-01), Yamazaki et al.
patent: 6388652 (2002-05-01), Yamazaki et al.
patent: 6410960 (2002-06-01), Arai
patent: 6423614 (2002-07-01), Doyle
patent: 6441474 (2002-08-01), Naitoh et al.
patent: 6503778 (2003-01-01), Yamauchi et al.
patent: 6506681 (2003-01-01), Grigg et al.
patent: 6589811 (2003-07-01), Sayyah
patent: 6645830 (2003-11-01), Shimoda
patent: 6677621 (2004-01-01), Yamazaki et al.
patent: RE38466 (2004-03-01), Inoue
patent: 6737300 (2004-05-01), Ding et al.
patent: 6780677 (2004-08-01), Imasu et al.
patent: 6818850 (2004-11-01), Bridges
patent: 6830494 (2004-12-01), Yamazaki et al.
patent: 6846703 (2005-01-01), Shimoda
patent: 6883934 (2005-04-01), Kawakami et al.
patent: 6946361 (2005-09-01), Takayama et al.
patent: 6998282 (2006-02-01), Yamazaki
patent: 7050138 (2006-05-01), Yamazaki
patent: 7094665 (2006-08-01), Shimoda
patent: 7214555 (2007-05-01), Yamazaki
patent: 2001/0040298 (2001-11-01), Baba
patent: 2002/0016028 (2002-02-01), Arao et al.
patent: 2002/0024096 (2002-02-01), Yamazaki
patent: 2002/0030189 (2002-03-01), Ishikawa
patent: 2002/0055237 (2002-05-01), Sayyah
patent: 2002/0100941 (2002-08-01), Yonehara
patent: 2002/0131007 (2002-09-01), Yamazaki et al.
patent: 2002/0146893 (2002-10-01), Shimoda et al.
patent: 2003/0025118 (2003-02-01), Yamazaki et al.
patent: 2003/0032210 (2003-02-01), Takayama et al.
patent: 2003/0047280 (2003-03-01), Takayama et al.
patent: 2003/0047732 (2003-03-01), Yamazaki et al.
patent: 2003/0057423 (2003-03-01), Shimoda
patent: 2003/0064569 (2003-04-01), Takayama et al.
patent: 2003/0082889 (2003-05-01), Maruyama et al.
patent: 2003/0217805 (2003-11-01), Takayama et al.
patent: 2003/0231263 (2003-12-01), Kato et al.
patent: 2004/0046909 (2004-03-01), Sekiguchi
patent: 2004/0087110 (2004-05-01), Takayama et al.
patent: 2004/0121516 (2004-06-01), Yamazaki et al.
patent: 2004/0140547 (2004-07-01), Yamazaki et al.
patent: 2004/0212012 (2004-10-01), Yamazaki et al.
patent: 2004/0232413 (2004-11-01), Yamazaki et al.
patent: 2004/0238827 (2004-12-01), Takayama et al.
patent: 2004/0263712 (2004-12-01), Yamazaki
patent: 2005/0001211 (2005-01-01), Yamazaki et al.
patent: 2005/0070038 (2005-03-01), Yamazaki
patent: 2006/0030122 (2006-02-01), Shimoda
patent: 2007/0010067 (2007-01-01), Shimoda
patent: 1256792 (2000-06-01), None
patent: 10047963 (2001-03-01), None
patent: 0 858 110 (1998-08-01), None
patent: 1017100 (2000-07-01), None
patent: 1229582 (2002-08-01), None
patent: 1351308 (2003-10-01), None
patent: 1603163 (2005-12-01), None
patent: 1655633 (2006-05-01), None
patent: 1744365 (2007-01-01), None
patent: 1758169 (2007-02-01), None
patent: 60-178424 (1985-09-01), None
patent: 06-244360 (1994-09-01), None
patent: 08-186156 (1996-07-01), None
patent: 08-262474 (1996-10-01), None
patent: 10-125929 (1998-05-01), None
patent: 10-125930 (1998-05-01), None
patent: 10-125931 (1998-05-01), None
patent: 11-020360 (1999-01-01), None
patent: 11-074533 (1999-03-01), None
patent: 2000-004024 (2000-01-01), None
patent: 2000-061785 (2000-02-01), None
patent: 2000-294723 (2000-10-01), None
patent: 2002-049359 (2002-02-01), None
patent: 2002 189447 (2002-07-01), None
patent: 2002-244576 (2002-08-01), None
patent: 3408154 (2003-05-01), None
Exhibition of Active Matrix Type Organic EL Display at “13thFlat Panel Display Manufacturing Technology Expo&Conference” by ELDis Group; Jul. 2, 2003 (full translation).
Documents distributed in the“13thFlat Panel Display Manufacturing Technology Expo&Conference” by ELDis Group; Jul. 3, 2003 (full translation).
“Mass Production of Organic EL Devices”;Shimotsuke Newspaper; Jul. 3, 2003 (full translation).
“Two-way display developed”; Newspaper “The Japan Times”; Jul. 3, 2003.
Watanabe et al.; “Anisotropic Conductive Films for Flat Panel Displays”;AM-LCD/IDW '96; pp. 369-372; Nov. 27, 1996.
European Search Report dated Aug. 22, 2006 for European Patent Office Application No. 03029012.6, 5 pages.
Zhang, X. et al., “Thermal Conductivity and Diffusivity of Free-Standing Silicon Nitride Thin Films”;Review of Scientific Instruments, vol. 66, No. 2, Part 1; pp. 1115-1120; Feb. 1995.
Office Action, Chinese Patent Application No. 200310123558.0; CN6847 dated Jun. 8, 2007.
Arakawa Etsuko
Goto Yuugo
Kuwabara Hideaki
Maruyama Junya
Ohno Yumiko
Fish & Richardson P.C.
Picardat Kevin M.
Semiconductor Energy Laboratory Co,. Ltd.
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