Semiconductor device and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Reexamination Certificate

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C257S640000, C257S642000

Reexamination Certificate

active

07038303

ABSTRACT:
An object of the present invention is to increase adhesiveness between thin films, particularly a high molecular film formed on an insulating surface, and the present invention provides a semiconductor device with high reliability and a method for manufacturing the semiconductor device with high yield. A semiconductor device of the present invention comprises a laminate structure formed in close contact with an organic insulating film on a hydrophobic surface of an inorganic insulating film including silicon and nitrogen. A film having the hydrophobic surface is an insulating film having a contact angle of water of equal to or more than 30°, preferably of equal to or more than 40°.

REFERENCES:
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patent: 6057038 (2000-05-01), Terashita et al.
patent: 6329062 (2001-12-01), Gaynor
patent: 6559066 (2003-05-01), Terashita et al.
patent: 6573195 (2003-06-01), Yamazaki et al.
patent: 2002/0018881 (2002-02-01), Terashita et al.
patent: 2003/0031877 (2003-02-01), Veerasamy et al.
patent: 2004/0061437 (2004-04-01), Ikagawa
patent: 10-048607 (1998-02-01), None
Wolf, S., Silicon Processing for the VLSI Era, vol. 2, Lattice Press, 1990, pp. 273-283.

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