Semiconductor device and method for manufacturing the same

Details Semiconductor device and method for manufacturing the same Semiconductor device and method for manufacturing the same

2005-08-16

2005-08-16

Clark, S. V. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

Reexamination Certificate

active

06930396

ABSTRACT:
There is provided a semiconductor device in which a plurality of semiconductor chips is stacked in layers and sealed in a package, including: a lower-layer semiconductor chip which is mounted on a package board; an upper-layer semiconductor chip which is stacked via a plurality of spacers on the lower-layer semiconductor chip; at least one first conductor interconnecting electrically at least one first electrode on the lower-layer semiconductor chip and at least one first internal terminal on the package board; at least one second conductor electrically interconnecting at least one second electrode on the upper-layer semiconductor chip and at least one second internal terminal on the package board; and the package for sealing therein the lower-layer semiconductor chip, the upper-layer semiconductor chip, and the at least one first conductor and the at least one second conductor which are all on the package board.

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