Semiconductor device and method for manufacturing the same

Details Semiconductor device and method for manufacturing the same Semiconductor device and method for manufacturing the same

2005-05-17

2005-05-17

Zarneke, David A. (Department: 2827)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S127000, C264S272110, C264S272170, C257S667000

Reexamination Certificate

active

06893903

ABSTRACT:
A semiconductor device (21) can include, e.g., a recessed portion (25) on the reverse surface (224) of an insulating resin (22) which is the mounting surface of the semiconductor device (21). Additionally, on the outer peripheral surface of the recessed portion (25), the exposed region of leads (26) and the reverse surface (224) of the insulating resin (22) form generally the same plane. This allows, e.g., a QFN semiconductor device (21) according to preferred embodiments herein to place dust particles in the recessed portion (25) even in the presence of dust particles such as crushed burr particles of the leads (26) or plastic burrs, thereby avoiding mounting deficiencies when mounting the semiconductor device.

REFERENCES:
patent: 5293065 (1994-03-01), Chan
patent: 6309575 (2001-10-01), Boutin et al.
patent: 6424023 (2002-07-01), Kim et al.
patent: 20030087478 (2003-05-01), Kasuga et al.
patent: 08-181160 (1996-07-01), None

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