Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent
1999-07-27
2000-07-25
Smith, Matthew
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
257668, 257673, 257700, 438613, 438737, 438106, H01L 2348
Patent
active
060939702
ABSTRACT:
An improved semiconductor device and method of manufacturing employs interconnecting films on film circuit as ground lines which extend to the periphery of the film circuit where there is a further connection to a conductive reinforcing plate 25. Advantageously, the conductive reinforcing plate reduces electrical noise from interfering with the semiconductor device and prevents the semiconductor device from radiating undesired signals. The interconnecting films also reduce cross-talk between signal lines of the semiconductor device.
REFERENCES:
patent: 4246595 (1981-01-01), Noyori et al.
patent: 4356374 (1982-10-01), Noyori et al.
patent: 5068714 (1991-11-01), Seipler
patent: 5793117 (1998-08-01), Shimada et al.
patent: 5986338 (1999-11-01), Nakajima
Ito Makoto
Ohsawa Kenji
Otsuka Yasushi
Sato Kazuhiro
Smith Matthew
Sony Corporation
Yevsikov Victor
LandOfFree
Semiconductor device and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for manufacturing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1338518