Semiconductor device and method for manufacturing the same

Details Semiconductor device and method for manufacturing the same Semiconductor device and method for manufacturing the same

1997-11-12

2000-08-08

Picard, Leo P.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257737, 257788, 257783, H01L 2160, H06K 114

Patent

active

061005975

ABSTRACT:
In a face-down mount type of semiconductor device and a method of manufacturing the same, an external connection pad (6) of a circuit board (2) and a conductive bump (3) of a semiconductor chip (1) are coupled to each other, and thermoplastic resin (7) and curable resin (5) are filled into a gap (11) between the semiconductor chip (1) and the circuit board (2).

REFERENCES:
patent: 4326238 (1982-04-01), Takeda et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5508561 (1996-04-01), Tago et al.
patent: 5543585 (1996-08-01), Booth et al.
patent: 5633204 (1997-05-01), Tago et al.
patent: 5872400 (1999-02-01), Chapman et al.
Kazuhisa Tsunoi, et al., "Solderless Microbonding Technology Using Adhesive for Mobile PCs", ISHM '95 Proceedings, pp. 284-289.

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