Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent
1997-10-31
1999-04-06
Booth, Richard A
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
29854, 257687, 257690, 174 524, H01L 2144, H01L 2148, H01L 2150
Patent
active
058917586
ABSTRACT:
A method of manufacturing a semiconductor device includes the steps of: mounting a semiconductor chip on a holding board having electrode accommodation recesses formed thereon, and mounting electrode members to the electrode accommodation recesses, the electrode members being formed separately from the semiconductor element; electrically connecting electrode pads formed on the semiconductor chip with the electrode members; forming a resin package for sealing the semiconductor chip on the holding board by using a die, the holding board serving as a part of the die; and separating the resin package including the electrode members from the holding board. A semiconductor device includes: a semiconductor chip; a resin package for sealing the semiconductor chip; electrode members which are embedded in and held by the resin package and which are partly exposed from a mounting surface so as to form external connection terminals; and connecting parts electrically connecting electrode pads on the semiconductor chip with the electrode members.
REFERENCES:
patent: 5298460 (1994-03-01), Nishiguchi et al.
patent: 5656550 (1997-08-01), Tsuji et al.
Honda Toshiyuki
Oku Akihiro
Tsuji Kazuto
Watanabe Takanori
Yoneda Yoshiyuki
Booth Richard A
Fujitsu Limited, Ltd.
Jones Josetta I.
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