Semiconductor device and method for manufacturing same

Details Semiconductor device and method for manufacturing same Semiconductor device and method for manufacturing same

1995-09-08

1997-02-11

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437219, H01L 2160

Patent

active

056020597

ABSTRACT:
A semiconductor device includes a flat package substrate having a main surface on which is defined a semiconductor chip mount surface portion and onto which a semiconductor chip is to be mounted and a peripheral surface portion surrounding the semiconductor chip mount surface portion. An electrically insulating elastic layer is provided on the peripheral surface portion of the flat package substrate and a wiring pattern film is provided on an exposed main surface of the elastic layer. The wiring pattern film includes a base insulting film and wiring patterns which are formed on the base insulation film, each wiring pattern having a first end connected to an external connection terminal and a second end connected to the semiconductor chip. The semiconductor chip is sealed with a resin by potting.

REFERENCES:
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5382546 (1995-01-01), Yamada et al.
patent: 5383269 (1995-01-01), Rathmell et al.
patent: 5409865 (1995-04-01), Karnezos

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