Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-07-09
2011-11-01
Lee, Eugene (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C257S706000, C257SE21499, C257SE21502, C257SE23051, C257SE23092, C257SE23128, C438S111000, C438S112000, C438S118000, C438S122000, C438S123000, C438S124000, C438S127000
Reexamination Certificate
active
08048714
ABSTRACT:
A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. A housing at least in part encloses the semiconductor die and the interlayer material. The housing has a recess disposed through the second attachment surface of the electrically conductive attachment region. A dielectric, thermally conductive interlayer material is located in the recess and secured to the housing. A metallic plate is located in the recess and secured to the interlayer material.
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Chou Ta-Te
Fu Hai
Li Xian
Tian Yong-Qi
Zhang Xiong-Jie
Gumedzoe Peniel M
Lee Eugene
Mayer Stuart H.
Mayer & Williams PC
Vishay General Semiconductor LLC
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