Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state
Reexamination Certificate
2011-03-29
2011-03-29
Luu, Chuong A. (Department: 2813)
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Using structure alterable to nonconductive state
C257SE21003, C438S281000
Reexamination Certificate
active
07915096
ABSTRACT:
A semiconductor device includes a fuse pattern formed as conductive polymer layer having a low melting point. The fuse pattern is easily cut at low temperature to improve repair efficiency. The semiconductor device includes first and second fuse connecting patterns that are separated from each other by a distance, a fuse pattern including a conductive polymer layer formed between the first and second fuse connection patterns and connecting the first and second fuse connection patterns, and a fuse box structure that exposes the fuse pattern.
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Doan Nga
Hynix / Semiconductor Inc.
Kilpatrick Townsend & Stockton LLP
Luu Chuong A.
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