Semiconductor device and method for fabricating the same

Details Semiconductor device and method for fabricating the same Semiconductor device and method for fabricating the same

2011-05-31

2011-05-31

Luu, Chuong A. (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S118000, C438S119000, C438S612000

Reexamination Certificate

active

07951644

ABSTRACT:
A semiconductor device and a method for fabricating the same, including: a substrate having a mounting surface formed with a plurality of bonding fingers and covered with an insulating layer, the insulating layer having an opening formed therein for exposing the bonding fingers; and a chip coupled to the substrate and including a body, a self-adhesive protective layer, and a plurality of bumps protruding from the self-adhesive protective layer. The self-adhesive protective layer is formed on the chip but leaves the bumps exposed. The self-adhesive protective layer is made of a photosensitive adhesive, thermosetting adhesive, or dielectric material. The chip is coupled to the substrate via the self-adhesive protective layer, thus allowing the bumps to be electrically connected to the bonding fingers and at least an end of the opening to be exposed. The method enables a more streamlined manufacturing process and lower fabrication costs by dispensing with adhesive dispensing.

REFERENCES:
patent: 2005/0136635 (2005-06-01), Savastiouk et al.
patent: 2007/0045836 (2007-03-01), Kwon et al.

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