Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2000-04-03
2001-10-23
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
C438S113000
Reexamination Certificate
active
06306731
ABSTRACT:
CROSS REFERENCE TO RELATED APPLICATION
This application claims the priority of Application No. H11-287959, filed Oct. 8, 1999 in Japan, the subject matter of which is incorporated herein by reference.
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor device and a method for fabricating the same, in which electrical connection is carried out with a via-hole.
BACKGROUND OF THE INVENTION
In a conventional method for fabricating a semiconductor device, circuit elements are formed on a semiconductor substrate. The circuit elements are electrically connected to a lead frame through a conductive layer, provided in a via-hole of the semiconductor substrate. Therefore, no wire-bonding process is required.
However, the semiconductor substrate is divided along a dicing line, which is positioned between the next two via-holes, so that a hole is left on each individual semiconductor device. As a result, it is difficult to distribute a larger area for the circuit elements, and it is difficult to increase the degree of integration of semiconductor devices.
OBJECTS OF THE INVENTION
Accordingly, an object of the present invention is to provide a method for fabricating a semiconductor device, in which the degree of integration of circuit elements is improved.
Another object of the present invention is to provide a semiconductor device, in which the degree of integration of circuit elements is improved.
Additional objects, advantages and novel features of the present invention will be set forth in part in the description that follows, and in part will become apparent to those skilled in the art upon examination of the following or may be learned by practice of the invention. The objects and advantages of the invention may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.
SUMMARY OF THE INVENTION
According to the present invention, a method includes the steps of providing a semiconductor substrate; providing first and second circuit elements on a surface of the semiconductor substrate; and forming a hole in the semiconductor substrate between the first and second circuit elements. The method also includes the step of dividing the semiconductor substrate at the hole to separate the first and second circuit elements from each other.
The semiconductor device is divided along a dicing line that is overlapped with the hole, so that a wider area can be provided for the circuit elements on the semiconductor substrate.
REFERENCES:
patent: 6124179 (2000-09-01), Adamic, Jr.
Igarashi Tadashi
Tsukuda Akinori
Jones Volentine PLLC
Nelms David
Nhu David
OKI Electric Industry Co., Ltd.
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