Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2008-08-04
2010-10-05
Nhu, David (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S068000, C257S296000, C257SE21011, C257SE21170, C257SE21590, C257SE21229, C257SE21257, C257SE21304, C257SE21582, C257SE21646
Reexamination Certificate
active
07808077
ABSTRACT:
A semiconductor device is composed of: an interconnect made of a first conductive film and a second conductive film that are stacked in sequence from the interconnect underside on an insulating film formed on a substrate; and a capacitor composed of a lower capacitor electrode made of the first conductive film, a dielectric film formed on the lower capacitor electrode, and an upper capacitor electrode made of the second conductive film and formed on the dielectric film.
REFERENCES:
patent: 6175131 (2001-01-01), Adan
patent: 6300239 (2001-10-01), Ono
patent: 6320213 (2001-11-01), Kirlin et al.
patent: 6384442 (2002-05-01), Chen
patent: 6500724 (2002-12-01), Zurcher et al.
patent: 6555428 (2003-04-01), Jung
patent: 6709918 (2004-03-01), Ng et al.
patent: 6825092 (2004-11-01), Zurcher et al.
patent: 6893935 (2005-05-01), Lachner
patent: 7190045 (2007-03-01), Egashira et al.
patent: 7538005 (2009-05-01), Egashira et al.
patent: 0 989 615 (2000-03-01), None
patent: 62-42553 (1985-08-01), None
patent: 01-223757 (1988-03-01), None
patent: 2001-203329 (2000-01-01), None
patent: 2000-101023 (2000-04-01), None
patent: 2001-358304 (2001-12-01), None
patent: 2002-217373 (2002-08-01), None
patent: 2000-0023348 (2000-04-01), None
patent: WO 02/17367 (2002-02-01), None
European Search Report issued in European Patent Application No. EP 04007727.3, mailed Feb. 25, 2009.
Japanese Office Action, with English Translation, issued in Japanese Patent Application No. 2003-094213 dated Apr. 15, 2008.
Egashira Kyoko
Hashimoto Shin
McDermott Will & Emery LLP
Nhu David
Panasonic Corporation
LandOfFree
Semiconductor device and method for fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and method for fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for fabricating the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4241480