Semiconductor device and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S638000, C257SE29002, C438S778000, C438S783000

Reexamination Certificate

active

07851891

ABSTRACT:
A method for fabricating a semiconductor device includes the steps of: forming a first insulating film on a semiconductor substrate; removing part of the first insulating film; forming a second insulating film having a leakage current density higher than that of the first insulating film on a region where the part of the first insulating film has been removed on the semiconductor substrate; forming an undoped semiconductor film on the first and second insulating films; implanting an impurity into part of the undoped semiconductor film, thereby defining semiconductor regions of a first conductivity type dotted as discrete islands; forming a third insulating film on the semiconductor regions of the first conductivity type and the undoped semiconductor film; and removing part of the third insulating film by wet etching. At least the second insulating film is formed under the semiconductor regions of the first conductivity type.

REFERENCES:
patent: 4893158 (1990-01-01), Mihara et al.
patent: 4912061 (1990-03-01), Nasr
patent: 5416352 (1995-05-01), Takada
patent: 5633523 (1997-05-01), Kato
patent: 5641980 (1997-06-01), Yamaguchi et al.
patent: 5710461 (1998-01-01), Nguyen et al.
patent: 5753525 (1998-05-01), Hsu et al.
patent: 5807770 (1998-09-01), Mineji
patent: 5854502 (1998-12-01), Nishihara
patent: 5904490 (1999-05-01), Tabara
patent: 5925904 (1999-07-01), Schmidt et al.
patent: 5986284 (1999-11-01), Kusaba et al.
patent: 6008095 (1999-12-01), Gardner et al.
patent: 6172733 (2001-01-01), Hong et al.
patent: 6188136 (2001-02-01), Asamura
patent: 6225667 (2001-05-01), Buynoski et al.
patent: 6278154 (2001-08-01), Abe
patent: 6335285 (2002-01-01), Chun et al.
patent: 6376309 (2002-04-01), Wang et al.
patent: 6903420 (2005-06-01), Wang
patent: 2002/0155661 (2002-10-01), Massingill et al.
patent: 2002/0179978 (2002-12-01), Sato
patent: 2003/0134486 (2003-07-01), Wang
patent: 2003/0151449 (2003-08-01), Nakagawa et al.
patent: 2003/0201494 (2003-10-01), Maeda et al.
patent: 57-062564 (1982-04-01), None
patent: 59-125654 (1984-07-01), None
patent: 02-307261 (1990-12-01), None
patent: 03-206657 (1991-09-01), None
patent: 05-067777 (1993-03-01), None
patent: 9-82896 (1997-03-01), None
patent: 10-74846 (1998-03-01), None
patent: 10-144904 (1998-05-01), None
patent: 2001-230425 (2001-08-01), None
R.L. Smith et al., “Porous Silicon Formation Mechanisms”, American Institute of Physics, J. Appl. Phys. 71, pp. R1-R22, Apr. 15, 1992.
S. Wolf, “Silicon Processing for the VLSI Era, vol. 3—The Submicron MOSFET”, Lattice Press, Sunset Beach, CA (ISBN: 0-961672-3) (1995), pp. 134-137.
“Modern Semiconductor Device Physics”, Ed. by S.M. Sze, John Wiley & Sons, New York (ISBN: 0-471-15237-4) (1998), Appendix J on p. 545.
O. Madelung, Semiconductors-Basic Data, 2nd revised Edition, Springer Verlag, Berlin—Heidelberg—New York (ISBN: 3-540-60883-4) (1996); p. 18.
Computerized Translation of “Semiconductor Device and Manufacturing Method” Patent JP—09082896 A (IDS item), (Date: Mar. 28, 1997).
Merriam-Webster's Collegiate Dictionary, tenth Edition, p. 847 (Merriam-Webster, Inc., Springfield, MA (USA) (1999).
English Translation of Japanese Notice of Reasons for Rejection issued in Japanese Patent Application No. JP 2003-005668, mailed Aug. 25, 2009.
Japanese Office Action, with English Translation, issued in Japanese Patent Application No. JP 2003-005668, dated Dec. 16, 2009.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method for fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method for fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for fabricating the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4222976

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.