Semiconductor device and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C257S767000, C438S653000

Reexamination Certificate

active

07339270

ABSTRACT:
A semiconductor device has a porous low-dielectric-constant film formed on a substrate and having an opening and a fine particle film composed of a plurality of aggregately deposited fine particles each having a diameter of not less than 1 nm and not more than 2 nm and formed on a surface of the portion of the porous low-dielectric-constant film which is formed with the opening. The fine particles are filled in voids exposed at the surface of the portion of the porous low-dielectric-constant film which is formed with the opening.

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Akira Furuya, et al., “Pore-sealing by Etch-Byproduct Followed by ALD-Ta Adhesion Layer for Cu/Porous Low-k Interconnects”, IEEE, IITC 2004, pp. 39-41.

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