Semiconductor device and method for fabricating the same

Details Semiconductor device and method for fabricating the same Semiconductor device and method for fabricating the same

2007-07-31

2007-07-31

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S113000, C257SE21238

Reexamination Certificate

active

11220921

ABSTRACT:
A semiconductor device according to the present invention includes a semiconductor substrate, which comprises a first surface on which an electrode pad is formed, and a second surface arranged at an opposite side of the first surface; an external terminal formed on the first surface of the semiconductor substrate and is electrically connected to the electrode pad; and a sealing resin which seals the first surface so that a surface of the external terminal is exposed. An outer edge of the second surface has a chamfered portion, a surface of which is inclined by substantially 45 degrees from the second surface.

REFERENCES:
patent: 5128282 (1992-07-01), Ormond et al.
patent: 6276995 (2001-08-01), Matsuta et al.
patent: 6455920 (2002-09-01), Fukasawa et al.
patent: 6482730 (2002-11-01), Masumoto et al.
patent: 6790709 (2004-09-01), Dias et al.
patent: 2003-060120 (2003-02-01), None

Affiliated with

Also associated with

Rating

Semiconductor device and method for fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method for fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for fabricating the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3816845