Semiconductor device and method for fabricating the same

Details Semiconductor device and method for fabricating the same Semiconductor device and method for fabricating the same

2007-03-20

2007-03-20

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000, C438S118000

Reexamination Certificate

active

10607274

ABSTRACT:
A wafer on which semiconductor elements, a multilevel interconnect layer, a bonding pad, a passivation film, and the like are formed is coated with a buffer coat film. Thereafter, the buffer coat film is patterned by exposure and development so that parts of the buffer coat film located on the bonding pads and scribe line regions and a part of the buffer coat film located on a periphery region of the wafer are removed, thereby forming apertures. The rear surface of the wafer is polished by polishing slurry with a surface protection tape bonded to the surface of the wafer by adhesive paste. In the periphery region, the apertures including the scribe line regions are blocked by the adhesive paste so that polishing slurry does not permeate.

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