Semiconductor device and method for fabricating the...

Details Semiconductor device and method for fabricating the... Semiconductor device and method for fabricating the...

2007-07-24

2007-07-24

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S786000, C257S678000, C257S702000, C257S711000

Reexamination Certificate

active

10836143

ABSTRACT:
A semiconductor device has a semiconductor substrate, at least a first and second rewiring device on a first surface of the semiconductor substrate for the provision of an electrical contact-connection of the semiconductor substrate, and a tapering, continuous opening from a first surface to a second, opposite surface of the semiconductor substrate. At least a third and fourth rewiring device is disposed on the second surface of the semiconductor substrate and a patterned metallization on the side areas of the opening for the separate contact-connection of the first and at least the second rewiring device.

REFERENCES:
patent: 4897708 (1990-01-01), Clements
patent: 6396153 (2002-05-01), Fillion et al.
patent: 2002/0158345 (2002-10-01), Hedler et al.
patent: 2002/0185730 (2002-12-01), Ahn et al.
patent: 197 50 559 (1999-02-01), None
patent: 100 56 281 (2002-05-01), None
patent: 101 20 408 (2002-10-01), None
patent: 96/13062 (1996-05-01), None
patent: 99/08318 (1999-02-01), None

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