Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1998-09-21
2000-01-04
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257690, 257779, 257734, H01L 2348
Patent
active
060113065
ABSTRACT:
A pad on a semiconductor chip is connected to a solder ball, which communicates with an external circuit, without using a lead, thereby increasing the degree of freedom of bonding, and miniaturizing the semiconductor device. An insulative shaft provided with conductive parts on its surface is attached to the semiconductor chip generally parallel to the surface of the chip. The pad on the chip is connected to the conductove part of the insulator shaft via a bonding wire, and the solder ball is joined to the conductive part.
REFERENCES:
patent: 5521435 (1996-05-01), Mizukoshi
patent: 5535101 (1996-07-01), Miles et al.
patent: 5659952 (1997-08-01), Kovac et al.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5770479 (1998-06-01), Brooks et al.
patent: 5834339 (1998-11-01), Distefano et al.
Nadav Ori
NEC Corporation
Thomas Tom
LandOfFree
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