Semiconductor device and method for fabricating...

Details Semiconductor device and method for fabricating... Semiconductor device and method for fabricating...

2006-04-04

2006-04-04

Quach, T. N. (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000, C438S460000, C438S465000

Reexamination Certificate

active

07022552

ABSTRACT:
A semiconductor device includes a semiconductor chip having an electrode pad electrically connected to an integrated circuit and a conducting part electrically connected to the electrode pad; an insulating material formed on a side of the semiconductor chip; and a conductive pattern to extend from a top of a front side of the insulating material to the conducting part of the semiconductor chip.

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