Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-09-06
2005-09-06
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S775000
Reexamination Certificate
active
06940166
ABSTRACT:
In a semiconductor device having an uppermost layer wiring beneath a bump to be connected to a rewiring layer wiring, the uppermost layer wiring is formed so that the surface of a protection film covered with the uppermost layer wiring has no unevenness beneath the bump.
REFERENCES:
patent: 6545354 (2003-04-01), Aoki et al.
patent: 6812565 (2004-11-01), Nishimoto et al.
patent: 2002/0111009 (2002-08-01), Huang et al.
patent: A-01-120040 (1989-05-01), None
Iseda Yasunaga
Kanazawa Hideki
Ho Tu-Tu
Matsushita Electric - Industrial Co., Ltd.
McDermott Will & Emery LLP
Nelms David
LandOfFree
Semiconductor device and method for designing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and method for designing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for designing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3397810