Semiconductor device and method

Details Semiconductor device and method Semiconductor device and method

2011-06-07

2011-06-07

Tran, Thien F (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S675000, C257S676000, C257SE21510

Reexamination Certificate

active

07956446

ABSTRACT:
A chip carrier includes first, second and third layers with the second layer situated between the first and third layers. The first and third layers are formed of a first material and the second layer is formed of a second material. The second layer has a plurality of holes extending therethrough and the first material fills the holes.

REFERENCES:
patent: 4320412 (1982-03-01), Hynes et al.
patent: 4996115 (1991-02-01), Eerkes et al.
patent: 5015803 (1991-05-01), Mahulikar et al.
patent: 2002/0172025 (2002-11-01), Megahed et al.
patent: 2006/0051895 (2006-03-01), Abe et al.
patent: 2006/0055011 (2006-03-01), Carney et al.
patent: 2008/0053523 (2008-03-01), Brown et al.

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