Semiconductor device and manufacturing the same

Details Semiconductor device and manufacturing the same Semiconductor device and manufacturing the same

2006-04-04

2006-04-04

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S050510, C361S718000, C361S719000

Reexamination Certificate

active

07023706

ABSTRACT:
A semiconductor device capable of attaining the reduction of size is disclosed. The semiconductor device comprises a module substrate having a surface and a back surface, a control chip mounted on the surface of the module substrate, plural chip parts mounted on the surface in adjacency to the control chip, first and second output chips mounted on the back surface of the module substrate, plural lands formed on the back surface of the module substrate, and a seal portion formed of resin to seal the control chip and the plural chip parts, wherein the first and second output chips are larger in the amount of heat generated than the control chip, the heat from the first and second output ships is radiated to a mother board, and packaging parts on the surface side of the module substrate are sealed with only a sealing resin without using a metallic case or the like to attain the reduction in size of the module.

REFERENCES:
patent: 5295045 (1994-03-01), Kitano et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5796165 (1998-08-01), Yoshikawa et al.
patent: 5864174 (1999-01-01), Yamada et al.
patent: 6075995 (2000-06-01), Jensen
patent: 6163456 (2000-12-01), Suzuki et al.
patent: 6833993 (2004-12-01), Wang
patent: 6879488 (2005-04-01), Takeda et al.
patent: 2004/0026777 (2004-02-01), Yokoyama et al.
patent: 2000-299427 (2000-10-01), None

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