Semiconductor device and manufacturing the same

Details Semiconductor device and manufacturing the same Semiconductor device and manufacturing the same

2006-01-24

2006-01-24

Nhu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S706000

Reexamination Certificate

active

06989587

ABSTRACT:
There is provided a semiconductor device with enhanced reliability having a heat sink mounting a plurality of semiconductor chips, a plurality of inner leads connected electrically to the semiconductor chips, a molding body for resin molding the plurality of semiconductor chips and the plurality of inner leads, a plurality of wires for providing electrical connections between the respective electrodes of the semiconductor chips and the inner leads corresponding thereto, and wide outer leads connecting to the inner leads and exposed outside the molding body. A plurality of slits are formed in the respective portions of the outer leads located outside the molding body to extend lengthwise in directions in which the outer leads are extracted. This achieves a reduction in lead stress which is placed on the outer leads by thermal stress or the like after the mounting of a MOSFET and thereby enhances the reliability of the MOSFET.

REFERENCES:
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patent: 5907474 (1999-05-01), Dolbear
patent: 5949649 (1999-09-01), Bartlow
patent: 6703261 (2004-03-01), Ito
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patent: 11-330859 (1999-11-01), None
patent: 2002-349218 (2000-12-01), None
patent: 2002-76158 (2002-03-01), None

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