Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1982-04-16
1986-01-21
Hearn, Brian E.
Metal working
Method of mechanical manufacture
Assembling or joining
29571, 29578, 29589, 29591, 148 15, 148DIG50, 148DIG131, 427 47, 427 38, 427 39, 156647, 156657, 357 55, H01L 2176, H01L 21302
Patent
active
045649979
ABSTRACT:
A semiconductor device in which a film of an insulator a conductor is closely deposited in a groove formed in a semiconductor substrate or an insulating or conductor layer thereon to planarize the surface thereof.
A semiconductor device manufacturing process in which a specimen is selectively etched away through using a resist pattern as a mask, a pattern forming film is deposited by a plasma deposition technique on the specimen, and the resist film is removed, whereby the pattern forming film closed fills up a groove formed by etching to provide a planarized surface.
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Ehara Kohei
Itsumi Manabu
Matsuo Seitaro
Muramoto Susumu
Hearn Brian E.
Hey David A.
Nippon-Telegraph and Telephone Public Corporation
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