Semiconductor device and manufacturing process therefor

Details Semiconductor device and manufacturing process therefor Semiconductor device and manufacturing process therefor

2007-11-13

2007-11-13

Picardat, Kevin M. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S773000

Reexamination Certificate

active

11342527

ABSTRACT:
An objective of this invention is to allow each process of contacting of a test probe and bonding to be reliably conducted within a given region. A semiconductor device100has a probing mark111forming region; a bonding pad110having a bonding region113;and a check mark120separate from the bonding pad110.In the configuration, the probing mark111forming region and the bonding region113can be identified on the basis of a planar shape of the check mark120.

REFERENCES:
patent: 6563226 (2003-05-01), Harun et al.
patent: 6713881 (2004-03-01), Umehara et al.
patent: 6784556 (2004-08-01), Lin
patent: 6897669 (2005-05-01), Ishio et al.
patent: 2003/0197289 (2003-10-01), Lin
patent: 2004/0069988 (2004-04-01), Lin et al.
patent: 2001-338955 (2001-12-01), None

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