Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2006-10-03

2011-10-18

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S030000, C257SE25032

Reexamination Certificate

active

08039288

ABSTRACT:
A high performance electric device which uses an adhesive layer over a substrate. A color filter is over a substrate, and an adhesive layer is also located over the substrate and color film. An insulating layer is over the adhesive layer, and thin film transistors cover the insulating film and the color filters. Light emitting elements cover the thin film transistors and emit light through the substrate that is through the adhesive layer and color filter. The substrate may be plastic, thus increasing the heat resistance.

REFERENCES:
patent: 4749440 (1988-06-01), Blackwood et al.
patent: 4963788 (1990-10-01), King et al.
patent: 5040875 (1991-08-01), Noguchi
patent: 5058997 (1991-10-01), Dickerson et al.
patent: 5206749 (1993-04-01), Zavracky
patent: 5247190 (1993-09-01), Friend
patent: 5276999 (1994-01-01), Bando
patent: 5317236 (1994-05-01), Zavracky
patent: 5317431 (1994-05-01), Yoshida et al.
patent: 5376561 (1994-12-01), Vu
patent: 5396304 (1995-03-01), Salerno et al.
patent: 5399502 (1995-03-01), Friend
patent: 5559397 (1996-09-01), Tsuruoka et al.
patent: 5643826 (1997-07-01), Ohtani
patent: 5654811 (1997-08-01), Spitzer
patent: 5693956 (1997-12-01), Shi et al.
patent: 5757126 (1998-05-01), Harvey, III et al.
patent: 5757456 (1998-05-01), Yamazaki
patent: 5781164 (1998-07-01), Jacobsen
patent: 5800952 (1998-09-01), Urano et al.
patent: 5821138 (1998-10-01), Yamazaki et al.
patent: 5834327 (1998-11-01), Yamazaki
patent: 5870157 (1999-02-01), Shimada et al.
patent: 5923962 (1999-07-01), Ohtani
patent: 5929961 (1999-07-01), Nishi et al.
patent: 6031290 (2000-02-01), Miyazaki et al.
patent: 6043800 (2000-03-01), Spitzer
patent: 6118502 (2000-09-01), Yamazaki
patent: 6127199 (2000-10-01), Inoue et al.
patent: 6140980 (2000-10-01), Spitzer
patent: 6252253 (2001-06-01), Bao et al.
patent: 6274887 (2001-08-01), Yamazaki
patent: 6280559 (2001-08-01), Terada et al.
patent: 6320204 (2001-11-01), Hirabayashi et al.
patent: 6320309 (2001-11-01), Nomura et al.
patent: 6372608 (2002-04-01), Shimoda et al.
patent: 6376333 (2002-04-01), Yamazaki
patent: 6392340 (2002-05-01), Yoneda et al.
patent: 6433486 (2002-08-01), Yokoyama
patent: 6437769 (2002-08-01), Kobayashi et al.
patent: 6445005 (2002-09-01), Yamazaki
patent: 6476783 (2002-11-01), Matthies et al.
patent: 6548960 (2003-04-01), Inukai
patent: 6580214 (2003-06-01), Yoneda et al.
patent: 6636185 (2003-10-01), Spitzer
patent: 6645830 (2003-11-01), Shimoda et al.
patent: RE38466 (2004-03-01), Inoue et al.
patent: 6730966 (2004-05-01), Koyama
patent: 6781152 (2004-08-01), Yamazaki
patent: 6784457 (2004-08-01), Yamazaki
patent: 6818530 (2004-11-01), Shimoda et al.
patent: 6936846 (2005-08-01), Koyama et al.
patent: 6998282 (2006-02-01), Yamazaki et al.
patent: 7060153 (2006-06-01), Yamazaki et al.
patent: 7094665 (2006-08-01), Shimoda et al.
patent: 7113154 (2006-09-01), Inukai
patent: 7214555 (2007-05-01), Yamazaki et al.
patent: 7271858 (2007-09-01), Yamazaki et al.
patent: 7285476 (2007-10-01), Shimoda et al.
patent: 7425931 (2008-09-01), Yamazaki et al.
patent: RE40601 (2008-12-01), Inoue et al.
patent: 7468308 (2008-12-01), Shimoda et al.
patent: 7483091 (2009-01-01), Yamazaki et al.
patent: 7776663 (2010-08-01), Yamazaki et al.
patent: 2001/0015256 (2001-08-01), Yamazaki et al.
patent: 2001/0025958 (2001-10-01), Yamazaki et al.
patent: 2001/0040645 (2001-11-01), Yamazaki
patent: 2002/0021266 (2002-02-01), Koyama et al.
patent: 2003/0146712 (2003-08-01), Inukai
patent: 2005/0001215 (2005-01-01), Koyama
patent: 2005/0040400 (2005-02-01), Yamazaki
patent: 2005/0162421 (2005-07-01), Yamazaki et al.
patent: 2005/0162578 (2005-07-01), Yamazaki et al.
patent: 2008/0309585 (2008-12-01), Yamazaki et al.
patent: 2009/0298210 (2009-12-01), Yamazaki et al.
patent: 0 412 921 (1991-02-01), None
patent: 0 858 110 (1998-08-01), None
patent: 0909972 (1999-04-01), None
patent: 0999595 (2000-05-01), None
patent: 1 018 718 (2000-07-01), None
patent: 1085576 (2001-03-01), None
patent: 1 103 946 (2001-05-01), None
patent: 1 351 308 (2003-10-01), None
patent: 1 655 633 (2006-05-01), None
patent: 1 744 365 (2007-01-01), None
patent: 1 758 169 (2007-02-01), None
patent: 2319650 (1998-05-01), None
patent: 60-222822 (1985-11-01), None
patent: 63-060427 (1988-03-01), None
patent: 01-099026 (1989-04-01), None
patent: 05-093806 (1993-04-01), None
patent: 06-148685 (1994-05-01), None
patent: 06-308310 (1994-11-01), None
patent: 07-130652 (1995-05-01), None
patent: 07-235680 (1995-09-01), None
patent: 07-248491 (1995-09-01), None
patent: 08-096959 (1996-04-01), None
patent: 08-146402 (1996-06-01), None
patent: 08-162269 (1996-06-01), None
patent: 08-254686 (1996-10-01), None
patent: 08-262475 (1996-10-01), None
patent: 08-274336 (1996-10-01), None
patent: 08-288522 (1996-11-01), None
patent: 09-063770 (1997-03-01), None
patent: 09-312260 (1997-12-01), None
patent: 10-092576 (1998-04-01), None
patent: 10-161104 (1998-06-01), None
patent: 10-247735 (1998-09-01), None
patent: 10-270363 (1998-10-01), None
patent: 11-026734 (1999-01-01), None
patent: 11-191487 (1999-07-01), None
patent: 11-191628 (1999-07-01), None
patent: 11-214151 (1999-08-01), None
patent: 11-251059 (1999-09-01), None
patent: 11-345688 (1999-12-01), None
patent: 2000-098919 (2000-04-01), None
patent: 2000-235348 (2000-08-01), None
patent: 2001-175198 (2001-06-01), None
patent: 2001-331120 (2001-11-01), None
patent: 2004-327269 (2004-11-01), None
patent: 98-10576 (1998-04-01), None
patent: WO 90/13148 (1990-11-01), None
Keller, Harald and Erb, Uwe; “Dictionary of Engineering Materials”; 2004; John Wiley & Sons, Inc.; p. 391-392.
European Search Report Application No. 01102321.5; Ref. No. EP 20607-045/we; dated Apr. 27, 2006 (3 pages).
Hong, et al., “New Approaches to Process Simplification for Large Area and High Resolution TFT-LCD”, IDMC 2000, pp. 219-223.
Schenk, et al., “Polymers for Light Emitting Diodes”, EuroDisplay '99 Proceedings, pp. 33-37.
Baldo, M et al., “Highly Efficient Phosphorescent Emission From Organic Electroluminescent Devices,” Nature, Sep. 10, 1998, vol. 395, pp. 151-154.
Baldo, M et al., “Very High-Efficiency Green Organic Light-Emitting Devices Based on Electrophosphorescence,” Appl. Phys. Lett. (Applied Physics Letters), Jul. 5, 1999, vol. 75, No. 1, pp. 4-6.
Office Action, European Application No. 01102321.5, dated Nov. 9, 2010, 5 pages.
Search Report, European Application No. 10009977.9, dated Nov. 12, 2010, 9 pages.
Inukai, K., U.S. Appl. No. 09/724,387, dated Sep. 1, 2004.
Lee, S, “Lunar Building Materials-Some Considerations on the Use of Inorganic Polymers,” http://www.nas.nasa.gov./about/education/spacesettlement/spaceres/v-3.html, Jul. 10, .2002.
Tsutsui, T et al., “Electroluminescence in Organic Thin Films,” Photochemical Processes in Organized Molecular Systems, 1991, pp. 437-450 Elsevier Science Publishers B.V., 1991.
Tsutsui, T et al., “High Quantum Efficiency in Organic Light-Emitting Devices With Iridium Complex As a Triplet Emissive Center,” JPN. J. Appl. Phys. (Japanese Journal of Applied Physics), Dec. 15, 1999, vol. 38, No. 12B, pp. L1502-L1504.
Yamazaki, Set al., U.S. Appl. No. 09/760,499 dated Feb. 26, 2003.

Affiliated with

Also associated with

Rating

Semiconductor device and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4264868