Active solid-state devices (e.g. – transistors – solid-state diode – Organic semiconductor material
Reexamination Certificate
2005-04-07
2009-12-15
Nguyen, Thinh T (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Organic semiconductor material
C257S059000, C257S072000, C257SE51046, C438S082000, C438S099000
Reexamination Certificate
active
07633085
ABSTRACT:
It is an object of the present invention to provide a manufacturing method of semiconductor device whereby the number of processes is decreased due to simultaneously forming a contact hole in a lamination film of different material and film thickness (inorganic insulating film and organic resin film by conducting etching once. By setting the selective ratio of dry etching (etching rate of organic resin film503/etching rate of inorganic insulating film502containing nitrogen) from 1.6 to 2.9, preferably 1.9, the shape and the size of the contact holes to be formed even in a film of different material and film thickness can be nearly the same in both of the contact holes.
REFERENCES:
patent: 3844908 (1974-10-01), Matsuo et al.
patent: 4103297 (1978-07-01), McGreivy et al.
patent: 4226898 (1980-10-01), Ovshinsky et al.
patent: 4239346 (1980-12-01), Lloyd
patent: 4254426 (1981-03-01), Pankove
patent: 4448491 (1984-05-01), Okubo
patent: 4523370 (1985-06-01), Sullivan et al.
patent: 4557036 (1985-12-01), Kyuragi et al.
patent: 4597637 (1986-07-01), Ohta
patent: 4618878 (1986-10-01), Aoyama et al.
patent: 4650922 (1987-03-01), McPherson
patent: 4680580 (1987-07-01), Kawahara
patent: 4705358 (1987-11-01), Yamazaki et al.
patent: 4722913 (1988-02-01), Miller
patent: 4759610 (1988-07-01), Yanagisawa
patent: 4800174 (1989-01-01), Ishihara et al.
patent: 4804490 (1989-02-01), Pryor et al.
patent: 4818077 (1989-04-01), Ohwada et al.
patent: 4845533 (1989-07-01), Pryor et al.
patent: 4853760 (1989-08-01), Abe et al.
patent: 4864376 (1989-09-01), Aoki et al.
patent: 4869755 (1989-09-01), Huschka et al.
patent: 4938565 (1990-07-01), Ichikawa
patent: 4949141 (1990-08-01), Busta
patent: 4972250 (1990-11-01), Omori et al.
patent: 5003356 (1991-03-01), Wakai et al.
patent: 5012228 (1991-04-01), Masuda et al.
patent: 5051570 (1991-09-01), Tsujikawa et al.
patent: 5055899 (1991-10-01), Wakai et al.
patent: 5056895 (1991-10-01), Kahn
patent: 5066110 (1991-11-01), Mizushima et al.
patent: 5084905 (1992-01-01), Sasaki et al.
patent: 5091334 (1992-02-01), Yamazaki et al.
patent: 5101288 (1992-03-01), Ohta et al.
patent: 5117278 (1992-05-01), Bellersen et al.
patent: 5117299 (1992-05-01), Kondo et al.
patent: 5132821 (1992-07-01), Nicholas
patent: 5166085 (1992-11-01), Wakai et al.
patent: 5176791 (1993-01-01), Itoh et al.
patent: 5196954 (1993-03-01), Yamazaki et al.
patent: 5200846 (1993-04-01), Hiroki et al.
patent: 5206183 (1993-04-01), Dennison
patent: 5227900 (1993-07-01), Inaba et al.
patent: 5229644 (1993-07-01), Wakai et al.
patent: 5233211 (1993-08-01), Hayashi et al.
patent: 5235195 (1993-08-01), Tran et al.
patent: 5250451 (1993-10-01), Chouan
patent: 5286659 (1994-02-01), Mitani et al.
patent: 5287205 (1994-02-01), Yamazaki et al.
patent: 5289016 (1994-02-01), Noguchi
patent: 5306651 (1994-04-01), Masumo et al.
patent: 5327001 (1994-07-01), Wakai et al.
patent: 5330616 (1994-07-01), Yamazaki
patent: 5371398 (1994-12-01), Nishihara
patent: 5392143 (1995-02-01), Akiyama et al.
patent: 5414547 (1995-05-01), Matsuo et al.
patent: 5422658 (1995-06-01), Kawaguchi et al.
patent: 5432527 (1995-07-01), Yanai et al.
patent: 5453406 (1995-09-01), Chen
patent: 5453858 (1995-09-01), Yamazaki
patent: 5461501 (1995-10-01), Sato et al.
patent: 5474941 (1995-12-01), Mitani et al.
patent: 5477359 (1995-12-01), Okazaki
patent: 5481121 (1996-01-01), Zhang et al.
patent: 5488000 (1996-01-01), Zhang et al.
patent: 5495353 (1996-02-01), Yamazaki et al.
patent: 5499123 (1996-03-01), Mikoshiba
patent: 5500538 (1996-03-01), Yamazaki et al.
patent: 5501739 (1996-03-01), Yamada et al.
patent: 5514879 (1996-05-01), Yamazaki
patent: 5529951 (1996-06-01), Noguchi et al.
patent: 5536950 (1996-07-01), Liu et al.
patent: 5550066 (1996-08-01), Tang et al.
patent: 5568288 (1996-10-01), Yamazaki et al.
patent: 5572046 (1996-11-01), Takemura
patent: 5583369 (1996-12-01), Yamazaki et al.
patent: 5585951 (1996-12-01), Noda et al.
patent: 5594569 (1997-01-01), Konuma et al.
patent: 5604380 (1997-02-01), Nishimura et al.
patent: 5612799 (1997-03-01), Yamazaki et al.
patent: 5614732 (1997-03-01), Yamazaki
patent: 5621556 (1997-04-01), Fulks et al.
patent: 5641974 (1997-06-01), den Boer et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5652029 (1997-07-01), Itoh
patent: 5654203 (1997-08-01), Ohtani et al.
patent: 5684365 (1997-11-01), Tang et al.
patent: 5686328 (1997-11-01), Zhang et al.
patent: 5686980 (1997-11-01), Hirayama et al.
patent: 5696386 (1997-12-01), Yamazaki
patent: 5701167 (1997-12-01), Yamazaki
patent: 5705829 (1998-01-01), Miyanaga et al.
patent: 5706067 (1998-01-01), Colgan et al.
patent: 5712495 (1998-01-01), Suzawa
patent: 5714968 (1998-02-01), Ikeda
patent: 5717224 (1998-02-01), Zhang
patent: 5721601 (1998-02-01), Yamaji et al.
patent: 5724107 (1998-03-01), Nishikawa et al.
patent: 5731628 (1998-03-01), Terashima
patent: 5739549 (1998-04-01), Takemura et al.
patent: 5747830 (1998-05-01), Okita
patent: 5748165 (1998-05-01), Kubota et al.
patent: 5751381 (1998-05-01), Ono et al.
patent: 5763899 (1998-06-01), Yamazaki et al.
patent: 5766696 (1998-06-01), Itoh
patent: 5777701 (1998-07-01), Zhang
patent: 5784201 (1998-07-01), Lee et al.
patent: 5808315 (1998-09-01), Murakami et al.
patent: 5815223 (1998-09-01), Watanabe et al.
patent: 5815231 (1998-09-01), Nishi et al.
patent: 5818550 (1998-10-01), Kadota et al.
patent: 5820947 (1998-10-01), Itoh
patent: 5821138 (1998-10-01), Yamazaki et al.
patent: 5837619 (1998-11-01), Adachi et al.
patent: 5844254 (1998-12-01), Manning et al.
patent: 5847410 (1998-12-01), Nakajima
patent: 5849043 (1998-12-01), Zhang et al.
patent: 5849601 (1998-12-01), Yamazaki
patent: 5851862 (1998-12-01), Ohtani et al.
patent: 5856689 (1999-01-01), Suzawa
patent: 5859445 (1999-01-01), Yamazaki
patent: 5869363 (1999-02-01), Yamazaki et al.
patent: 5869803 (1999-02-01), Noguchi et al.
patent: 5871847 (1999-02-01), Itoh
patent: 5879741 (1999-03-01), Itoh
patent: 5899547 (1999-05-01), Yamazaki et al.
patent: 5905555 (1999-05-01), Yamazaki et al.
patent: 5922125 (1999-07-01), Zhang
patent: 5923962 (1999-07-01), Ohtani et al.
patent: 5926242 (1999-07-01), Kataoka et al.
patent: 5933205 (1999-08-01), Yamazaki et al.
patent: 5940053 (1999-08-01), Ikeda
patent: 5940732 (1999-08-01), Zhang
patent: 5943107 (1999-08-01), Kadota et al.
patent: 5946059 (1999-08-01), Yamazaki et al.
patent: 5952708 (1999-09-01), Yamazaki
patent: 5963278 (1999-10-01), Yamazaki et al.
patent: 5966193 (1999-10-01), Zhang et al.
patent: 5989672 (1999-11-01), Hayashi
patent: 5990491 (1999-11-01), Zhang
patent: 5990542 (1999-11-01), Yamazaki
patent: 5995189 (1999-11-01), Zhang
patent: 6001431 (1999-12-01), Itoh et al.
patent: 6005648 (1999-12-01), Zhang et al.
patent: 6011277 (2000-01-01), Yamazaki
patent: 6011529 (2000-01-01), Ikeda
patent: 6023075 (2000-02-01), Yamazaki
patent: 6055034 (2000-04-01), Zhang et al.
patent: 6071765 (2000-06-01), Noguchi et al.
patent: 6075580 (2000-06-01), Kouchi
patent: 6097459 (2000-08-01), Shimada et al.
patent: 6110542 (2000-08-01), Miyanaga et al.
patent: 6114715 (2000-09-01), Hamada
patent: 6115090 (2000-09-01), Yamazaki
patent: 6133073 (2000-10-01), Yamazaki et al.
patent: 6160272 (2000-12-01), Arai et al.
patent: 6163055 (2000-12-01), Hirakata et al.
patent: 6165582 (2000-12-01), Hayashi
patent: 6169293 (2001-01-01), Yamazaki
patent: 6171674 (2001-01-01), Yamazaki et al.
patent: 6183816 (2001-02-01), Yamazaki et al.
patent: 6194047 (2001-02-01), Hayashi
patent: 6195139 (2001-02-01), Yamazaki et al.
patent: 6204081 (2001-03-01), Kim et al.
patent: 6204101 (2001-03-01), Yamazaki et al.
patent: 6207281 (2001-03-01), Itoh
patent: 6217661 (2001-04-01), Hirose et al.
patent: 6218206 (2001-04-01), Inoue et al.
patent: 6224952 (2001-05-01), Itoh
patent: 6225645 (2001-05-01), Zhang
patent: 6239470 (2001-05-01), Yamazaki
patent: 6249330 (2001-06-01), Yamaji et al.
patent: 6249333 (2001-06-01), Zhang et al.
patent: 6252249 (2001-06-01), Yamazaki
patent: 6252297 (2001-06-01), Kemmochi et al.
patent: 6258434 (2001-07-01), Hayashi
patent: 6261634 (2001-07-01), Itoh
patent: 6265070 (2001-07-01), Itoh
Kusuyama Yoshihiro
Suzawa Hideomi
Cook Alex Ltd.
Nguyen Thinh T
Semiconductor Energy Laboratory Co,. Ltd.
LandOfFree
Semiconductor device and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and manufacturing method thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4145968