Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2005-11-01

2009-10-06

Monbleau, Davienne (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S781000, C257SE23021

Reexamination Certificate

active

07598612

ABSTRACT:
A semiconductor device including a semiconductor substrate containing a plurality of electrode pads and a passivation film with an opening that exposes a central area of each of the electrode pads, and a bump electrically connected to each of the electrode pads, the bump being disposed to overlap the opening and an end of the opening, wherein at least part of an area contacting the bump on a surface of the passivation film is an uneven surface.

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patent: 2007/0273031 (2007-11-01), Lee et al.
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patent: A 2002-319587 (2002-10-01), None
patent: A 2005-347622 (2005-12-01), None
patent: A 2005-347623 (2005-12-01), None

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