Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2006-08-25
2009-11-03
Hoang, Quoc D (Department: 2892)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S149000, C257SE21600
Reexamination Certificate
active
07611965
ABSTRACT:
It is an object of the present invention to manufacture, with high yield, semiconductor devices in each of which an element which has a layer containing an organic compound is provided over a flexible substrate. A method for manufacturing a semiconductor device includes: forming a separation layer over a substrate; forming an element-forming layer by forming an inorganic compound layer, a first conductive layer, and a layer containing an organic compound over the separation layer, and forming a second conductive layer which is in contact with the layer containing an organic compound and the inorganic compound layer; and after attaching a first flexible substrate over the second conductive layer, separating the separation layer and the element-forming layer at the separation layer.
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Asami Yoshinobu
Nomura Ryoji
Ohsawa Nobuharu
Sato Takehisa
Suzuki Tsunenori
Cook Alex Ltd.
Hoang Quoc D
Semiconductor Energy Laboratory Co,. Ltd.
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