Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-12-12
2008-12-02
Lindsay, Jr., Walter L (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S106000, C438S597000, C257S698000, C257SE21499
Reexamination Certificate
active
07459340
ABSTRACT:
A semiconductor device includes a base plate made of a material including at least a thermosetting resin, and having an opening, a vertical conductor filled and provided in the opening of the base plate, at least one semiconductor construct having a semiconductor substrate and a plurality of external connection electrodes provided on one side of the semiconductor substrate, and an insulating layer secured to and provided on a periphery of the semiconductor construct. The insulating layer is secured to the base plate, and the external connection electrodes of the semiconductor construct are bonded to the vertical conductor.
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Mihara Ichiro
Wakabayashi Takeshi
Ahmadi Mohsen
Casio Computer Co. Ltd.
Frishauf Holtz Goodman & Chick P.C.
Lindsay, Jr. Walter L
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