Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2008-05-06

2008-05-06

Clark, S. V. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S126000, C438S108000

Reexamination Certificate

active

11200087

ABSTRACT:
A semiconductor device is provided which includes a first semiconductor chip, a substrate onto which the first semiconductor chip is flip-chip bonded and on which a concave is formed along one side of the first semiconductor chip which is flip-chip bonded, a second semiconductor chip which is flip-chip bonded onto a portion on the substrate opposite the first semiconductor chip across the concave on the substrate, and a resin applied to spaces between the substrate and the first and second semiconductor chips.

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