Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2007-04-03
2007-04-03
Niebling, John F. (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
C438S113000, C438S033000, C438S017000, C438S460000
Reexamination Certificate
active
10411283
ABSTRACT:
Dispersion of load may be kept within an allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane to a wafer by applying a pressure load to a plurality of places of a plane of pressure members on the side opposite from the wafer in a probe test step/burn-in test step which is one of semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit in the same time.
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Ariga Akihiko
Ban Naoto
Kasukabe Susumu
Kitano Makoto
Kohno Ryuji
Antonelli Terry Stout & Kraus LLP
Hitachi , Ltd.
Niebling John F.
Pompey Ron
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