Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2007-05-15

2007-05-15

Jackson, Jerome (Department: 2815)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S462000, C257SE21599

Reexamination Certificate

active

10845232

ABSTRACT:
A semiconductor device includes: a substrate having a main surface, a rear surface and four side surfaces; a semiconductor element formed on the main surface of the substrate; a notch formed in at least one bottom part of the side surfaces of the substrate; and a curved surface provided at an intersection of a side surface of the notch and the rear surface of the substrate.

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