Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2006-07-04

2006-07-04

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S777000, C257S723000, C257S784000, C257S787000

Reexamination Certificate

active

07071543

ABSTRACT:
A semiconductor device includes a die pad section, a first semiconductor chip having a surface formed with a first electrode section and a back surface fixed to the die pad section, a second semiconductor chip having a surface formed with a second electrode section and a back surface fixed to the surface of the first semiconductor chip, a support member having a surface fixed to the back surface of the second semiconductor chip and a back surface fixed to the die pad section, lead terminal sections respectively electrically connected to the first and second electrode sections, and a resin encapsulating body that seals the die pad section, the first and second semiconductor chips and the support member.

REFERENCES:
patent: 5229960 (1993-07-01), De Givry
patent: 6100594 (2000-08-01), Fukui et al.
patent: 6239366 (2001-05-01), Hsuan et al.
patent: 6252305 (2001-06-01), Lin et al.
patent: 6433421 (2002-08-01), Masuda et al.
patent: 7-58143 (1995-03-01), None
patent: 2000-277559 (2000-10-01), None
patent: 2001-298150 (2001-10-01), None
patent: 2002-217356 (2002-08-01), None
patent: 2002-373968 (2002-12-01), None
patent: 3096721 (2003-07-01), None

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