Semiconductor device, and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S347000, C257S390000, C349S042000

Reexamination Certificate

active

06953951

ABSTRACT:
In a display device such as a liquid crystal display device, a large-sized display screen is realized under low power consumption. A surface of a source wiring line of a pixel portion employed in an active matrix type liquid crystal display device is processed by way of a plating process operation so as to lower a resistance value of this source wiring line. The source wiring line of the pixel portion is manufactured at a step different from a step for manufacturing a source wiring line of a drive circuit portion. Further, electrodes of a terminal portion are processed by a plating process operation so as to reduce a resistance value thereof.

REFERENCES:
patent: 4033833 (1977-07-01), Bestel et al.
patent: 5498573 (1996-03-01), Whetten
patent: 5576858 (1996-11-01), Ukai et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5650636 (1997-07-01), Takemura et al.
patent: 5712495 (1998-01-01), Suzawa
patent: 5726461 (1998-03-01), Shimada et al.
patent: 5756147 (1998-05-01), Wu et al.
patent: 5777701 (1998-07-01), Zhang
patent: 5815226 (1998-09-01), Yamazaki et al.
patent: 5851918 (1998-12-01), Song et al.
patent: 5856689 (1999-01-01), Suzawa
patent: 5889291 (1999-03-01), Koyama et al.
patent: 5892562 (1999-04-01), Yamazaki et al.
patent: 5923962 (1999-07-01), Ohtani et al.
patent: 5929948 (1999-07-01), Ohori et al.
patent: 5977562 (1999-11-01), Hirakata et al.
patent: 5990998 (1999-11-01), Park et al.
patent: 5990999 (1999-11-01), Yeo
patent: 5998841 (1999-12-01), Suzawa
patent: 6015724 (2000-01-01), Yamazaki
patent: 6031290 (2000-02-01), Miyazaki et al.
patent: 6104461 (2000-08-01), Zhang et al.
patent: 6114715 (2000-09-01), Hamada
patent: 6118506 (2000-09-01), Yamazaki et al.
patent: 6137218 (2000-10-01), Kaneko et al.
patent: 6175395 (2001-01-01), Yamazaki et al.
patent: 6208395 (2001-03-01), Kanoh et al.
patent: 6274887 (2001-08-01), Yamazaki et al.
patent: 6278131 (2001-08-01), Yamazaki et al.
patent: 6281552 (2001-08-01), Kawasaki et al.
patent: 6303963 (2001-10-01), Ohtani et al.
patent: 6306694 (2001-10-01), Yamazaki et al.
patent: 6319741 (2001-11-01), Izumi et al.
patent: 6323515 (2001-11-01), Yamazaki et al.
patent: 6359320 (2002-03-01), Yamazaki et al.
patent: 6384818 (2002-05-01), Yamazaki et al.
patent: 6392255 (2002-05-01), Shibata et al.
patent: 6413845 (2002-07-01), Izumi et al.
patent: 6461899 (2002-10-01), Kitakado et al.
patent: 6469317 (2002-10-01), Yamazaki et al.
patent: 6489222 (2002-12-01), Yoshimoto
patent: 6500701 (2002-12-01), Higashi et al.
patent: 6509616 (2003-01-01), Yamazaki
patent: 6524877 (2003-02-01), Nakazawa et al.
patent: 6737304 (2004-05-01), Yamazaki et al.
patent: 2001/0010370 (2001-08-01), Kimura et al.
patent: 2001/0019374 (2001-09-01), Izumi et al.
patent: 2001/0025959 (2001-10-01), Yamazaki et al.
patent: 2001/0030322 (2001-10-01), Yamazaki et al.
patent: 2002/0008797 (2002-01-01), Yamazaki et al.
patent: 2002/0044230 (2002-04-01), Yamazaki et al.
patent: 2002/0070382 (2002-06-01), Yamazaki et al.
patent: 2002/0110941 (2002-08-01), Yamazaki et al.
patent: 2002/0127833 (2002-09-01), Izumi et al.
patent: 2002/0158288 (2002-10-01), Yamazaki et al.
patent: 2003/0038037 (2003-02-01), Colgan et al.
patent: 2003/0132436 (2003-07-01), Yamazaki
patent: 2004/0197971 (2004-10-01), Yamazaki et al.
patent: 2004/0217357 (2004-11-01), Zhang et al.
patent: 2005/0040403 (2005-02-01), Suzawa et al.
patent: 0 372 356 (1990-06-01), None
patent: 0 989 614 (2000-03-01), None
patent: 1 001 467 (2000-05-01), None
patent: 1 020 920 (2000-07-01), None
patent: 1 028 469 (2000-08-01), None
patent: 1 058 310 (2000-12-01), None
patent: 1 058 484 (2000-12-01), None
patent: 6-148685 (1994-05-01), None
patent: 07-130652 (1995-05-01), None
patent: 7-235680 (1995-09-01), None
patent: 7-297405 (1995-11-01), None
patent: 8-274336 (1996-10-01), None
patent: 08-330602 (1996-12-01), None
patent: 10-048640 (1998-02-01), None
patent: 10-90711 (1998-04-01), None
patent: 10-189252 (1998-07-01), None
patent: 10-270363 (1998-10-01), None
patent: 11-97701 (1999-04-01), None
patent: 11-097698 (1999-04-01), None
patent: 2000-332256 (2000-11-01), None
patent: 2001094238 (2001-04-01), None
patent: 2002-198537 (2002-07-01), None
Yamazaki et al., Office Action for U.S. Appl. No. 10/022,262, filed Mar. 12, 2004, 11 pages.
Austrian Patent Office Search Report and Written Opinion for Singapore Patent Application No. 200107527-4, Oct. 25, 2003, 7 pages.
Stanley Wolf; “Contact-Hole and Via Filling with Selective Electroless Metal Deposition”;Silicon Processing for the VLSI Era—vol. II; pp. 256-257; 1990.
M.A. Baldo et al.; “Highly efficient phosphorescent emission from organic electroluminescent devices”;Nature, vol. 395; pp. 151-154; Sep. 10, 1998.
M.A. Baldo et al.; “Very high-efficiency green organic light-emitting devices based on electrophosphorescence”;Applied Physics Letters, vol. 75, No. 1; pp. 4-6; Jul. 5, 1999.
Tetsuo Tsutsui et al.; “High Quantum Efficiency in Organic Light-Emitting Devices with Iridium-Complex as a Triplet Emissive Center”;Japan Journal of Applied Physics; vol. 38, Part 12B; pp. L1502-L1504; Dec. 15, 1999.
Pending U.S. Appl. No. 10/022,262, filed Dec. 20, 2001, Yamazaki et al.
Singapore International Search Report (Application No. 200107482-2), Jul. 6, 2004, 10 pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device, and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device, and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3486508

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.