Semiconductor device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With heterojunction

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S096000, C257S097000, C257S103000, C257S627000, C438S022000, C438S046000, C438S047000, C438S048000, C372S043010

Reexamination Certificate

active

06853008

ABSTRACT:
A semiconductor device has a structure in which a GaAs substrate and an InP substrate, different in lattice constant, are bonded to each other. An amorphous layer made of constituent atoms of the GaAs and InP substrates is formed at the interface between the GaAs and InP substrates. Forming the amorphous layer makes it possible to prevent a reduction of light-emitting efficiency caused by a thermal stress at the interface, even when a light-emitting layer by laser oscillation is formed near the interface. Besides, a linear current-voltage characteristic can be obtained at the interface.

REFERENCES:
patent: 5780873 (1998-07-01), Itaya et al.
patent: 61-183915 (1986-08-01), None
patent: 5-267790 (1993-10-01), None
patent: 6-349692 (1994-12-01), None
J.Piprek et al., “Abrupt self-switching in fused GaAs/Inp vertical-cavity lasers”, CLEO'99, May 27, 1999, pp 458.*
Patent Abstracts of Japan; Publication No.: 06090061 A; Date of Publication: Mar. 29, 1994. Abstract only.
R.J. Ram et al.;GaAs to InP Wafer Fusion; Journal of Applied Physics; vol. 78, pp 4227-4237; 1995.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3445855

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.