Semiconductor device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Bipolar transistor structure – With means to increase current gain or operating frequency

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Details

257592, 257588, 257586, 257526, 257518, H01L 27082, H01L 2970

Patent

active

056043740

ABSTRACT:
A semiconductor device comprises a semiconductor substrate having a main surface, a first semiconductor region of a first conductive type, formed on the main surface of the semiconductor substrate, a surrounding of the first semiconductor region is buried with a first insulation film, a second semiconductor region of a second conductive type, formed on the first insulation film and the first semiconductor region, a second insulation film, formed on the second semiconductor region, an end portion of the second insulation film is positioned above the first insulation film, and having an opening at a central portion thereof to be positioned above the first semiconductor region, and a third semiconductor region of a first conductivity type formed on a surface of the second semiconductor region exposed through the opening of the second insulation film.

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Anonymous, "High-Performance Bipolar Transistor with Metal-Silicide Collector Contact," IBM Technical Disclosure Bulletin, vol. 33, No. 12, May 1991, pp. 333-334.
Chang, J. J., "Self-Aligned Bipolar Transistor," IBM Techical Disclosure Bulletin, vol. 21, No. 7, Dec. 1978, pp. 2761-2762.

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