Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

1988-02-01

1990-01-02

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437209, 437219, 437224, 219 5622, 219148, H01L 2350

Patent

active

048913332

ABSTRACT:
This invention concerns a semiconductor device manufacturing method wherein connection is made of the end portion of aluminium bonding wire to a lead electrode of material selected from the group consisting of copper and copper alloy in a manner such that the reaction layer thickness is 0.2 micron or more, thereby resulting in excellent electrical characteristics in high temperature conditions or in high temperature, high humidity conditions.

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